Author: Aliasghari, S.
Paper Title Page
WEPRB011 PVD Depostion of Nb3Sn Thin Film on Copper Substrate from an Alloy Nb3Sn Target 2818
 
  • R. Valizadeh, S. Aliasghari, A.N. Hannah, O.B. Malyshev
    STFC/DL/ASTeC, Daresbury, Warrington, Cheshire, United Kingdom
  • K. Dawson, V. R. Dhanak
    The University of Liverpool, Liverpool, United Kingdom
  • G.B.G. Stenning
    STFC/RAL/ISIS, Chilton, Didcot, Oxon, United Kingdom
  • D. Turner
    STFC/DL, Daresbury, Warrington, Cheshire, United Kingdom
  • D. Turner
    Cockcroft Institute, Lancaster University, Lancaster, United Kingdom
 
  In this study we report on the PVD deposition of Nb3Sn on Cu substrates with and without a thick Nb interlayer to produce Cu/Nb/Nb3Sn and Cu/Nb3Sn multilayer structures. The Nb3Sn was sputtered directly from an alloy target at room and elevated temperatures. The dependence of the superconducting properties of the total structure on deposition parameters has been determined. The films have been characterized via SEM, XRD, EDX and SQUID magnetometer measurements. Analysis showed that the composition at both room and elevated temperature was within the desired stoichiometry of 24’25 at%. However, superconductivity was only observed for deposition at elevated temperature or post annealing at 650 °C. The critical temperature was determined to be in the range of 16.8 to 17.4 K. In the case of bilayer deposition, copper segregation from the interface all the way to the surface was observed.  
DOI • reference for this paper ※ https://doi.org/10.18429/JACoW-IPAC2019-WEPRB011  
About • paper received ※ 14 May 2019       paper accepted ※ 23 May 2019       issue date ※ 21 June 2019  
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